SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to improve the heat radiation efficiency of an electric device by forming a core substrate surrounding the electric device with metal materials. CONSTITUTION: An electric device(110) includes a first side(114). A core substrate(120) includes a cavity(122) and a supporter. An electric device is located in the cavity. The width of the cavity becomes narrow in an insertion direction of the electric device. The core substrate includes a second side which defines the cavity and includes a slope in a thickness direction. The supporter protrudes from the second side to the center of the cavity and supports the electric device.