Flat speaker apparatus with heat dissipating structure and method for heat dissipation of flat speaker

摘要

A flat speaker apparatus including a driving circuit module, a flat speaker and a thermally conductive connector, and with a heat dissipating structure is introduced. The flat speaker includes a porous electrode and a vibrating film. The porous electrode causes the vibrating film to vibrate according to an audio signal output from the driving circuit module for generating sound. The thermally conductive connector connects the driving circuit module and the flat speaker to conduct heat from the driving module to the flat speaker for dissipation. A method for heat dissipation of the flat speaker is also introduced herein.