发明名称 Thermal interface material with thin transfer film or metallization
摘要 According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
申请公布号 US8445102(B2) 申请公布日期 2013.05.21
申请号 US20080204228 申请日期 2008.09.04
申请人 STRADER JASON L.;WISNIEWSKI MARK;BRUZDA KAREN;CRAIG MICHAEL D.;LAIRD TECHNOLOGIES, INC. 发明人 STRADER JASON L.;WISNIEWSKI MARK;BRUZDA KAREN;CRAIG MICHAEL D.
分类号 B32B15/08;B32B37/10;B32B38/10 主分类号 B32B15/08
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