发明名称 |
Thermal interface material with thin transfer film or metallization |
摘要 |
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
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申请公布号 |
US8445102(B2) |
申请公布日期 |
2013.05.21 |
申请号 |
US20080204228 |
申请日期 |
2008.09.04 |
申请人 |
STRADER JASON L.;WISNIEWSKI MARK;BRUZDA KAREN;CRAIG MICHAEL D.;LAIRD TECHNOLOGIES, INC. |
发明人 |
STRADER JASON L.;WISNIEWSKI MARK;BRUZDA KAREN;CRAIG MICHAEL D. |
分类号 |
B32B15/08;B32B37/10;B32B38/10 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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