| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit device which realizes a resin sealing process, where a rear surface of a circuit board incorporating a circuit element on its upper surface is thinly resin-sealed, at low cost. <P>SOLUTION: According to this invention, an upper surface and a side surface of a circuit board 14, incorporating a hybrid integrated circuit, are coated by a first sealing resin 18 formed by transfer molding. Then, a lower surface of the circuit board 14 and a lower surface and a side surface of the first sealing resin 18 are coated by a second sealing resin 20. Further, in a process for forming the second sealing resin 20, an upper surface of the first sealing resin 18 is placed in contact with an inner wall of a second mold 50 and the position is fixed. This process realizes stable transfer molding. <P>COPYRIGHT: (C)2013,JPO&INPIT |
