MEMORY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a memory device and a semiconductor device with low manufacturing cost, and to provide a method of manufacturing the semiconductor device.

SOLUTION: There is provided a method of manufacturing a semiconductor device including a first chip mounted on a substrate and connected to the substrate by a bonding wire and a second chip mounted on the substrate so as to be stacked on the first chip and larger than the first chip. An insulating layer is applied to a portion on an adhesive surface of the second chip to the first chip corresponding to a portion in which the bonding wire is formed, an adhesive layer is formed on the adhesive surface of the second chip, and then the substrate and the second chip are bonded.

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