| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which allows wires to be connected stably in a less connection area on a slanted part, on a via and on a via cover, which are considered as an unavailable area for wire bonding. <P>SOLUTION: A semiconductor device comprises: a package including an opening, a die pad provided in the opening, a slanted part provided around the opening and an inner lead; a semiconductor chip including a first electrode pad and mounted on the die pad; and a first wire connecting the inner lead and the first electrode pad. At least a part of the inner lead is arranged on the slanted part and a first component on which the first wire is connected is arranged on the inner lead. <P>COPYRIGHT: (C)2013,JPO&INPIT |
