| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, in which a coil is provided above a semiconductor substrate, that allows forming a circuit in the semiconductor substrate directly under the coil. <P>SOLUTION: A semiconductor device includes a semiconductor substrate 10 having one surface 11, an insulating layer 20 formed on the one surface 11 of the semiconductor substrate 10, and a coil 30 formed on the insulating layer 20. The semiconductor substrate 10 is provided with slits 12 directly under the coil 30. These slits 12 are located directly under portions, of the coil 30, formed along one direction of surface directions parallel to the one surface 11 of the semiconductor substrate 10. As a result, since the eddy current area of the semiconductor substrate 10 is reduced by the slits 12 as borders, the loss due to an eddy current occurring in the semiconductor substrate 10 is reduced, thereby capable of forming a circuit in the semiconductor substrate 10 located under the coil 30. <P>COPYRIGHT: (C)2013,JPO&INPIT |
