| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for fabricating an electronics assembly that permits adjacent circuit elements to be positioned as physically close as possible without contamination of adjacent circuit elements from underfill or adhesive. <P>SOLUTION: The method includes forming a liquid barrier 30 on a substrate 12, placing a first circuit element 22 on one side of the liquid barrier, and placing a second circuit element 24 on the opposite side of the liquid barrier. A liquid 44 is applied to the first circuit element. The liquid barrier is used to prevent the liquid applied to the first circuit element from contaminating the second circuit element so that the spacing between the first and second circuit elements can be minimized. <P>COPYRIGHT: (C)2013,JPO&INPIT |
