| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the water resistance and the dust resistance of a housing where a conductive pattern is formed on a surface. <P>SOLUTION: A structure 10 includes: a housing 1 made of a dielectric substance; a conductive pattern 2 formed on a surface 1a of the housing 1; a conductive member 3 which includes a through part 3b, a first part 3a, and a second part 3c and holds the conductive pattern 2 and a surface 1b using the first part 3a and the second part 3c; and a squeeze packing 12 formed by an elastic body. <P>COPYRIGHT: (C)2013,JPO&INPIT |
