发明名称 |
Wafer lens member producing method, image pickup lens producing method, image pickup module producing method, and image pickup module-installed electronic device producing method |
摘要 |
A wafer lens member producing method includes post-curing lens portions made of a light-curing resin formed on at least one face of a substrate so as to promote curing of the light-curing resin. The post-curing includes first post-curing and second post-curing. The first post-curing performs heating at a first post-curing temperature, which is a glass transition temperature of the light-curing resin to the glass transition temperature+100° C., for 30 minutes to two hours. The second post-curing performs heating at a second post-curing temperature, which is lower than the glass transition temperature, and lower than the first post-curing temperature by 25° C. or more, for three hours to six hours. |
申请公布号 |
US2013118685(A1) |
申请公布日期 |
2013.05.16 |
申请号 |
US201213665836 |
申请日期 |
2012.10.31 |
申请人 |
HARA AKIKO;KONICA MINOLTA ADVANCED LAYERS, INC. |
发明人 |
HARA AKIKO |
分类号 |
B29D11/00 |
主分类号 |
B29D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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