| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic module ensuring high reliability for external vibration or mechanical shock, and to provide a manufacturing method therefor. <P>SOLUTION: A multilayer substrate 20 where build-up layers 2b, 2a are laminated on the upper and lower surfaces of a core layer 1 is used, an SAW filter 5 housed in an opening 3 penetrating the core layer 1 is built in a part of the wiring board 20, and then the terminal 5c of the SAW filter 5 and electronic components 12a, 12b are connected with a wiring/circuit pattern 10a formed on the build-up layer 2b on the upper surface. IC chips 11a, 11b are connected with and mounted on a wiring/circuit pattern 6b provided on the core layer 1 on the upper surface side of the wiring board 20, and a heat dissipation pattern 9 is provided on the surface of the build-up layer 2a on the lower surface of the wiring board 20. A plurality of via holes 4 for heat transmission are provided to penetrate the wiring board 20 from the upper surface to the lower surface and to reach the IC chips 11a, 11b and a heat dissipation pattern 9. A back-up plate 16 is fixed to entirely cover the upper surface on which a plurality of electronic components including the IC chips 11a, 11b are mounted. <P>COPYRIGHT: (C)2013,JPO&INPIT |
