发明名称 |
PRESSURE-SENSITIVE ADHESIVE SHEET FOR DICING AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING PRESSURE-SENSITIVE ADHESIVE SHEET FOR DICING |
摘要 |
An object of the present invention is to provide a pressure-sensitive adhesive sheet for dicing that is capable of preventing scratching of an adsorption stage when laser-scribing a semiconductor wafer. Provided is a pressure-sensitive adhesive sheet for dicing having a base and a pressure-sensitive adhesive layer provided on the base, in which 0.02 to 5 parts by weight of an ultraviolet absorber is contained in the pressure-sensitive adhesive layer with respect to 100 parts by weight of resin solid content, and in which the light transmittance at a wavelength of 355 nm of the pressure-sensitive adhesive sheet for dicing is 30% to 80%.
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申请公布号 |
US2013122688(A1) |
申请公布日期 |
2013.05.16 |
申请号 |
US201213811570 |
申请日期 |
2012.07.02 |
申请人 |
SASAKI TAKATOSHI;MIZUNO KOJI;ASAI FUMITERU;SHIGA GOJI;NITTO DENKO CORPORATION |
发明人 |
SASAKI TAKATOSHI;MIZUNO KOJI;ASAI FUMITERU;SHIGA GOJI |
分类号 |
H01L21/78 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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