发明名称 |
Localized CMP to Improve Wafer Planarization |
摘要 |
To provide improved planarization, techniques in accordance with this disclosure include a CMP station that utilizes localized planarization on a wafer. This localized planarization, which is often carried out in a localized planarization station downstream of a CMP station, applies localized planarization to less than the entire face of the wafer to correct localized non-planar features. Other systems and methods are also disclosed.
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申请公布号 |
US2013122613(A1) |
申请公布日期 |
2013.05.16 |
申请号 |
US201113295400 |
申请日期 |
2011.11.14 |
申请人 |
WANG SHENG-CHEN;WU FENG-INN;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
WANG SHENG-CHEN;WU FENG-INN |
分类号 |
H01L21/66;B24B7/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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