发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed herein is a method for manufacturing a printed circuit board, including: applying a solder resist to an insulating material; forming a cavity in the insulating material and the solder resist; forming a seed layer on a surface of the insulating material including the inside of the cavity; forming circuit patterns by plating the inside of the cavity; removing the seed layer formed on the surface of the solder resist; reapplying the solder resist on the solder resist from which the seed layer is removed; and opening a bump forming region of the reapplied solder resist, whereby micro circuits can be easily implemented. |
申请公布号 |
US2013118792(A1) |
申请公布日期 |
2013.05.16 |
申请号 |
US201213672063 |
申请日期 |
2012.11.08 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MIN BYUNG SEUNG |
分类号 |
H05K1/02;H05K3/10 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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