发明名称 HIDE-PUNCHING DEVICE, HIDE-PUNCHING METHOD AND HIDE SHEET
摘要 <p>This hide-punching device (1) comprises a receiving mold (21) in which receiving holes (22) are formed, a pressing mold (31) in which stowing holes (32) that communicate with the receiving holes (22) when united with the receiving mold (21) are formed, and a moving member (45) provided with punching pins (5) that are stowed in the stowing holes (32) of the pressing mold (31). The hide-punching device is provided with pressing projections (35) around the stowing holes (32) of the pressing mold (31). A hide (3) is disposed between the receiving mold (21) and the pressing mold (31), and the pressing projections (35) of the pressing mold (31) are placed in contact with the hide (3). By moving the moving member (45) to one side, the punching pins (5) protrude from the pressing projections (35) and form punch holes (9) in the hide (3).</p>
申请公布号 WO2013069600(A1) 申请公布日期 2013.05.16
申请号 WO2012JP78596 申请日期 2012.11.05
申请人 MIDORI HOKUYO CO., LTD. 发明人 MATSUMURA, KENSAKU
分类号 C14B5/00;B26F1/00;B26F1/02;B26F1/14 主分类号 C14B5/00
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