发明名称 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, VARIOUS ARTICLES DERIVED FROM THOSE
摘要 <p>A curable resin composition which is easily cured by heating or ultraviolet irradiation and capable of forming a thick cured film due to low shrinkage. This curable resin composition enables to obtain a cured product satisfying various characteristics such as heat resistance, chemical resistance, high surface hardness and high refractive index. Also disclosed is a cured product obtained from such a composition. Specifically disclosed is a curable resin composition containing at least one substance selected from the group consisting of condensates (A) obtained by hydrolyzing and condensing a thiol group-containing alkoxysilane (a1) represented by the following general formula: R1Si(OR2)3&emsp;&emsp;(1) (wherein, R1 represents a hydrocarbon group having at least one thiol group and 1-8 carbon atoms or an aromatic hydrocarbon group having at least one thiol group, and R2 represents a hydrogen atom, a hydrocarbon group having 1-8 carbon atoms or an aromatic hydrocarbon group), compounds (B) having an epoxy group, compounds (C) having an isocyanate group and compounds (D) having a carbon-carbon double bond.</p>
申请公布号 HK1120535(A1) 申请公布日期 2013.05.16
申请号 HK20080113575 申请日期 2008.12.15
申请人 ARAKAWA CHEMICAL INDUSTRIES LTD. 发明人 KIMIHIO MATSUKAWA;TAKESHI FUKUDA;HIDEKI GODA
分类号 C08L;C09D;C09K 主分类号 C08L
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