| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount an electronic component efficiently on a substrate having a through hole with high precision. <P>SOLUTION: The electronic component mounting device comprises: a substrate transfer section; a component supply unit having at least one electronic component supply device supplying an electronic component having lead wires; a head body; an imaging device fixed to the head support of the head body and capturing the image of the substrate; a storage section; and a control unit controlling the operation of the head body, the imaging device and the component supply unit. The control unit controls the imaging device to capture the image of a through hole formed in a substrate and a reference mark becoming the reference of a wiring pattern formed on the substrate surface, determines a reference mark correction value from a reference mark acquired from an image thus captured, calculates a through hole correction value from the deviation amount of the through hole position after correcting the reference mark and a through hole acquired from the image thus captured, and then determines the mounting position of an electronic component from the reference mark correction value and the through hole correction value. <P>COPYRIGHT: (C)2013,JPO&INPIT |
