EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing an embedded printed circuit board in which a cavity for embedding a chip is formed on an insulating layer configured of a photosensitive film by exposure and development processes.

SOLUTION: A method of manufacturing an embedded printed circuit board comprises: providing an insulating layer including photosensitive compositions; forming a cavity on the insulating layer by exposure and development processes; disposing a chip in a cavity; and forming a plating layer on the insulating layer on which the chip is disposed and forming a pattern by etching the plating layer.

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