| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power module having improved cooling performance without sacrificing insulation performance. <P>SOLUTION: A power module manufacturing method comprises: a step of forming a structure obtained by laminating a first heat spreader 4, semiconductor chips 1, 2 and a second heat spreader 8 in this order, adhering on one principal surface of the first heat spreader 4, a first insulation sheet 9 composed of an uncured thermosetting resin that is integrated with a first fixed plate 11, and adhering on one principal surface of the second heat spreader 8, a second insulation sheet 10 composed of an uncured thermosetting resin that is integrated with a second fixed plate 12; a step of placing the structure in a cavity of a mold for press molding; a step of clamping an upper mold 14 and a lower mold 15; and a step of curing the first insulation sheet 9, the second insulation sheet 10 and an uncured mold resin composed of a thermosetting resin by raising a temperature of the mold and implanting the uncured mold resin. <P>COPYRIGHT: (C)2013,JPO&INPIT |
