| 摘要 |
<P>PROBLEM TO BE SOLVED: To meet a demand for supplying a proper amount of solder balls on a mask surface and minimizing the occurrence of wasteful solder balls. <P>SOLUTION: A solder ball printing apparatus includes a mask which prints solder balls on an electrode formed on a substrate placed on a printing table and a solder ball filling head. The solder ball filling head is composed of a solder ball filling part and a solder ball supply part. The solder ball supply part has: a syringe where the solder balls are accumulated; a hose supplying the solder balls on a mask surface; and a structure which is provided at a mid part of the hose and is used for supplying the solder balls and stopping the supply of the solder balls when the syringe is vertically moved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
