| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip mounting substrate and a manufacturing method of the same, which can achieve thinning of a gold plating film; which can reduce manufacturing cost of the semiconductor chip mounting substrate; which can reduce an occurrence of a bridge even when forming micro wiring; and which can achieve excellent wire bondability and solder connection reliability. <P>SOLUTION: A semiconductor chip mounting substrate comprises: an insulation layer 21 consisting primarily of a resin; copper circuits 22, 3, 5 formed on the insulation layer 21; an electrolytic nickel plating film 7 formed on at least a part of the copper circuits 22, 3, 5; and terminals for wire bonding formed on at least a part of the electrolytic nickel plating film 7 and on each of which a gold plating film 8 is formed. A mean value of crystal grain sizes of the gold plating film 8 on a surface opposite to the electrolytic nickel plating film 7 is 5 μm and over. <P>COPYRIGHT: (C)2013,JPO&INPIT |
