发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 PURPOSE: A light emitting device package is provided to facilitate a mounting operation by forming a hole on at least one region of a lead frame. CONSTITUTION: A body includes a cavity(120). A first lead frame(140) and a second lead frame(150) are mounted on the body. A hole is formed on at least one region of the first lead frame and the second lead frame. A light emitting device is electrically connected to the first lead frame and the second lead frame. The hole includes a first part and a second part.
申请公布号 KR20130050147(A) 申请公布日期 2013.05.15
申请号 KR20110115344 申请日期 2011.11.07
申请人 LG INNOTEK CO., LTD. 发明人 AN, SANG HYUN
分类号 H01L33/48 主分类号 H01L33/48
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