ACOUSTIC SIGNAL/ELECTRIC SIGNAL CONVERTING PACKAGE

摘要

PURPOSE: An acoustic/electric signal converting package is provided to easily avoid damage to an acoustic/electric converting device. CONSTITUTION: A substrate(140) is mounted on a circuit board of an electronic device while making an acoustic inlet(141) to face an acoustic inlet hole of the circuit board side in a state of being equipped with the acoustic inlet. A cover case(160) defines a chamber region which is separated from the outside by covering the substrate. An acoustic/electric converting device(110) is arranged on the substrate and generates a sound by converting the sound into an electric signal in case the corresponding sound is inputted through the acoustic inlet hole and the acoustic inlet. An acoustic sealing pattern seals the leakage of the sound inputted to the acoustic inlet and the acoustic inlet hole by reinforcing the boundary surface of the substrate and the circuit board when the substrate is mounted on the circuit board of the electronic device side around the acoustic inlet. An acoustic in-flow hole opening passageway opens the acoustic inlet in one part of the acoustic sealing pattern to the outside of the acoustic sealing pattern.