| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of mounting components to a semiconductor device which is hardly deteriorated by the diffusion of Au-Al, and has no corrosion of an Au/Al contact part, and flip-chip bonds an Al electrode by a highly-reliable technique in terms of cost, and the mounting components of the semiconductor device. <P>SOLUTION: The method of mounting the first component 1 and the second component 2 of the semiconductor device has a process of supplying an Al pellet 5 having a first surface and a second surface positioned at an opposite side, a process of arranging the Al pellet 5 while being brought into contact with the first surface of the Al pellet 5 on the first component 1, a process of arranging the second component 2 on the Al pellet 5 while being brought into contact with the second surface of the Al pellet 5, and a process of jointing the first component 1 and the first surface of the Al pellet 5, and the second component 2 and the second surface of the Al pellet 5 in the same process by applying ultrasonic energy at predetermined conditions. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
