发明名称 Exposure determining method, method of manufacturing semiconductor device, and computer program product
摘要 According to one embodiment, a deviation amount distribution of a two-dimensional shape parameter between a mask pattern formed on a mask and a desired mask pattern is acquired as a mask pattern map. Such that a deviation amount of the two-dimensional shape parameter between a pattern on substrate formed when the mask is subjected to exposure shot to form a pattern on a substrate and a desired pattern on substrate fits within a predetermined range, an exposure is determined for each position in the exposure shot in forming the pattern on substrate based on the mask pattern map.
申请公布号 US8440376(B2) 申请公布日期 2013.05.14
申请号 US201113007238 申请日期 2011.01.14
申请人 KOTANI TOSHIYA;FUKUHARA KAZUYA;TAKIMOTO MICHIYA;MUKAI HIDEFUMI;INOUE SOICHI;KABUSHIKI KAISHA TOSHIBA 发明人 KOTANI TOSHIYA;FUKUHARA KAZUYA;TAKIMOTO MICHIYA;MUKAI HIDEFUMI;INOUE SOICHI
分类号 G03F9/00;G03C5/00 主分类号 G03F9/00
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