发明名称 Memory device and method of fabricating the same
摘要 A memory device and a method of fabricating the same are provided. The memory device includes a tunneling dielectric layer on a substrate, a charge storage layer on the tunneling dielectric layer, a blocking dielectric layer on the charge storage layer, the blocking dielectric layer including a first dielectric layer having silicon oxide, a second dielectric layer on the first dielectric layer and having aluminum silicate, and a third dielectric layer formed on the second dielectric layer and having aluminum oxide, and an upper electrode on the blocking dielectric layer.
申请公布号 US8440527(B2) 申请公布日期 2013.05.14
申请号 US20100659357 申请日期 2010.03.05
申请人 YOO DONG-CHUL;LEE EUN-HA;LEE HYUNG-IK;HWANG KI-HYUN;HEO SUNG;CHOI HAN-MEI;KYOUNG YONG-KOO;KIM BYONG-JU;SAMSUNG ELECTRONICS CO., LTD. 发明人 YOO DONG-CHUL;LEE EUN-HA;LEE HYUNG-IK;HWANG KI-HYUN;HEO SUNG;CHOI HAN-MEI;KYOUNG YONG-KOO;KIM BYONG-JU
分类号 H01L29/788;H01L21/336;H01L29/66;H01L29/792 主分类号 H01L29/788
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