发明名称 CASE MOLDED CAPACITOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a high reliable case molded capacitor. <P>SOLUTION: A case molded capacitor 1 comprises: a case 2 having an opening at the top; a plurality of capacitor elements 3 stored in the case; a molding resin 9 molding the capacitor elements 3; and a pair of bus bars 5a, 5b with one end connected to an end face electrode of the capacitor elements 3 and the other end exposed to the outside of the molding resin 9 and connected to external terminal respectively. The bus bars 5a, 5b are disposed along the inner wall of the case 2 and has plural through holes 8a, 8b a part of which is embedded in the molding resin 9. With this, the surface tension, which is generated on the molding resin 9 between the inner walls of the bus bar 5a, 5b and the case 2, is dispersed preventing the generation of a capillary phenomenon. As a result, the molding resin 9 is prevented from creeping-up. Thus, a high reliable case molded capacitor 1 is achieved. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013089654(A) 申请公布日期 2013.05.13
申请号 JP20110226433 申请日期 2011.10.14
申请人 PANASONIC CORP 发明人 NAKADA AYAKA;HISAMURA HIROTAKA
分类号 H01G4/228;H01G2/04;H01G2/10;H01G4/18 主分类号 H01G4/228
代理机构 代理人
主权项
地址
您可能感兴趣的专利