| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a molding apparatus configured in consideration of avoiding damage to a semiconductor element and deformation of an electrode plate. <P>SOLUTION: A molding apparatus is configured to: arrange an intermediate assembly W, which is composed of a semiconductor element 2, electrode plates 4 and 5 provided on front and rear surface sides of the semiconductor element 2 and a frame-shaped insulator 6, in a molding room R which is formed by an upper mold 8 and a lower mold 9 being abutted to the respective electrode plates 4 and 5 and being moved into a clamped state; and manufacture a semiconductor device 1 by filling the molding room R, which has the intermediate assembly W therein as an insert, with a resin material and molding the intermediate assembly W. Here, a mold-matching surface 10 between the upper and lower molds 8 and 9 directly clamps a direct clamping part 4a formed at a part of the upper electrode plate 4, whereas parts of the upper and lower molds 8 and 9 that abut to the electrode plates 4 and 5 other than the direct clamping part 4a are formed as rockable floating molds 8b and 9b. <P>COPYRIGHT: (C)2013,JPO&INPIT |
