| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce tact time of processing operation and also prevent contamination of a processing target substrate due to maintenance processing of a nozzle. <P>SOLUTION: An application processing apparatus includes a nozzle 31, nozzle movement means 32, nozzle maintenance means 35, and free section formation means 21, 22, 23A, 23B and 30. The nozzle 31 has a delivery port extending in a width direction of a processing target substrate G, is moved above the substrate on a processing stage in a substrate transport direction, and delivers a processing liquid from the delivery port onto the substrate. The nozzle movement means 32 can lift and move the nozzle, and can move the nozzle to an upstream side or a downstream side in the substrate transport direction. The nozzle maintenance means 35 is disposed below a substrate transport path 4, and fixes a state of the delivery port of the nozzle. The free section formation means 21, 22, 23A, 23B and 30 can form a free section d having a predetermined length so as to appear and disappear on an upstream side or a downstream side of the processing stage on the substrate transport path. <P>COPYRIGHT: (C)2013,JPO&INPIT |
