| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can form scan test paths in a variety of ways. <P>SOLUTION: The semiconductor device includes: a first through via and a second through via for electrically connecting a first chip and a second chip; a first circuit part which is disposed in the first chip, receives test data, and is connected with the first through via; a second circuit part which is disposed in the first chip and connected with the second through via and the first circuit part; and a third circuit part which is disposed in the second chip and connected with the first through via. The first circuit part outputs output signals of a first circuit to one of the first through via and the second circuit part in response to first control signals. <P>COPYRIGHT: (C)2013,JPO&INPIT |
