| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ebullient cooling device which cools semiconductor modules regardless of inclination directions of the ebullient cooling device. <P>SOLUTION: An ebullient cooling device 1 includes: multiple semiconductor modules 2 which respectively incorporate semiconductor elements; a pressure tank 3 sealing the semiconductor modules 2 with a refrigerant liquid 32; and a condenser 4 which is disposed above the pressure tank 3 and condenses vapor of the refrigerant liquid that is generated by heat generation of the semiconductor modules 2. The multiple semiconductor modules 2 are disposed around a vertical axis 10 so as to be rotationally symmetric. <P>COPYRIGHT: (C)2013,JPO&INPIT |
