| 摘要 |
<P>PROBLEM TO BE SOLVED: To take advantage of a variation in heat generation by a group of semiconductor elements in a power conversion apparatus to improve the cooling performance of a cooler, as well as minimize circuit inductance to reduce the size of the cooler. <P>SOLUTION: A group of semiconductor elements configuring a unit is installed in a cooler heat receiving section 1 so as to have their heat radiated naturally or by a current of air, so that first and fourth semiconductor elements Q1 and Q4 are disposed on the lower side of the cooler receiving section, while second and third semiconductor elements Q2 and Q3 are disposed at center, and a first diode D5 and a second diode D6 are disposed on the upper side. The first and the second semiconductor elements Q1 and Q2, and the third and the fourth semiconductor elements Q3 and Q4 are respectively arranged at mutually opposite positions in the lateral direction with respect to the center line in the vertical direction, while the first diode D5 is arranged on the same side as the second semiconductor element Q2 in the lateral direction with respect to the center line and the second diode D6 is arranged on the same side as the third semiconductor element Q3 in the lateral direction with respect to the center line. <P>COPYRIGHT: (C)2013,JPO&INPIT |
