EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin of which shows a small change in heat resistance after subjected to a thermal history and a low thermal expansion in a cured product, a curable resin composition having the characteristics, the cured product thereof, and a printed circuit board which exhibits a small change in heat resistance after subjected to a thermal history and a low thermal expansion.

SOLUTION: The new epoxy resin includes (A) diglycidyl ether of bisphenol and (B) polyglycidyl ether of bisphenol novolac. The epoxy resin is characterized in that when it is measured by13C-NMR, the ratio [(a)/(b)] of the integral value of (a) the peak appearing at 151-153 ppm to the integral value of (b) the peak appearing at 151-158 is in the range of 0.05 to 0.14. A curable resin composition uses the epoxy resin as the major component.

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