发明名称 ETCHANT AND METHOD FOR PROCESSING SURFACE OF SILICON SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide an etchant capable of forming a silicon substrate having fine pyramidal protrusions and recesses (texture structure) stably, without using a conventional etching retarder such as isopropyl alcohol. <P>SOLUTION: There is provided an etchant in which a silicon substrate is immersed in order to form pyramidal protrusions and recesses on the surface of the substrate. The etchant contains a compound (A) represented by following general formula (1) and alkali hydroxide (B). (In the formula (1), X represents a sulfonic acid group or an alkali salt thereof, R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>may be the same or different and each represent one kind selected from a group of hydrogen atom, alkyl group, alkenyl group, and alkynyl group (each having 1 or 2 carbon atoms) provided that the total number of carbon atoms of R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>is 0 to 2). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013089629(A) 申请公布日期 2013.05.13
申请号 JP20110225864 申请日期 2011.10.13
申请人 SHINRYO CORP 发明人 SHIRAHAMA TOSHIKI;MORISHITA YASUKO;SAWAI TAKESHI
分类号 H01L21/306;H01L31/04 主分类号 H01L21/306
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