发明名称 MULTI-CAVITY WIRING BOARD AND METHOD FOR MANUFACTURING SAME
摘要 <p>There are provided a multi-piece-array in which it is difficult for chipping, cracking, or breaking to occur from the vicinity of dividing grooves at the time of division or after division and which has high reliability, and a method of manufacturing the multi-piece-array. A multi-piece-array 1 is formed by laminating a plurality of ceramic layers s1 and s2 and has a front surface 2 and a back surface 3. The multi-piece-array 1 includes a product region 4a where a plurality of wiring board portions 4 having a rectangular shape in plan view and including cavities 5 are arranged in a matrix, an edge portion 6 that is positioned along the periphery of the product region 4a, and dividing grooves 8 and 9 that are formed on at least one of the front surface 2 and the back surface 3 along boundaries between the wiring board portions 4 and 4 and boundaries between the wiring board portions 4 and the edge portion 6. The deepest portions 8b of the dividing grooves 8 and 9 have an arc shape and each of the dividing grooves 8 and 9 includes a middle portion 8a between the deepest portion 8b and a groove inlet 8c on a cross-section orthogonal to an extending direction. The width w2 of the deepest portion 8b is greater than the width w3 of the groove inlet 8c and the width w1 of the middle portion 8a is equal to or less than the width w3 of the groove inlet 8c.</p>
申请公布号 KR20130048788(A) 申请公布日期 2013.05.10
申请号 KR20137007369 申请日期 2011.09.30
申请人 NGK SPARK PLUG COMPANY LIMITED 发明人 YOSHIDA YOSHITAKA;YAMAMOTO HIROAKI
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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