SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

Provided is a semiconductor device with which, while alleviating thermal resistance increases, it is possible to minimize thermal resistance which is applied to a solder layer. The semiconductor device has a positioning structure which comprises a semiconductor element (5), a solder layer (4) which is positioned on at least one face of the semiconductor layer, and a lead frame (2) which is positioned sandwiching a porous nickel plating part (1) against the semiconductor layer. The thermal resistance increase of the solder bonding part is restricted only to the increase from the porous nickel plating part and the thermal resistance which is applied to the solder layer may be reduced beyond that which results when directly bonding the semiconductor element to the lead frame.