| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board capable of preventing the printed wiring board from breaking even if a bend radius is small. <P>SOLUTION: A manufacturing method of a printed wiring board 1 comprises: a step S10 of forming a copper layer 23 of a wiring pattern 20 on a base film 10; a step S20 of laminating a coverlay 30 on the base film 10 and covering the copper layer 23 with the coverlay 30 while exposing a part of the copper layer 23; a step S30 of sticking a masking tape 40 to the coverlay 30; a step S40 of mechanically polishing at least an exposed part of the copper layer 23; a step S50 of removing the masking tape 40 from the coverlay 30; and steps S60 to S80 of forming a plating layer 24 on the copper layer 23 by plating the exposed part of the copper layer 23. The step S50 is performed between the step S40 and the steps S60 to S80 or after the steps S60 to S80. <P>COPYRIGHT: (C)2013,JPO&INPIT |
