| 发明名称 |
MULTILAYER WIRING BOARD, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF MULTILAYER WIRING BOARD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which allows a folded structure to be easily manufactured, and to provide an electronic apparatus and a manufacturing method of the wiring board. <P>SOLUTION: A multilayer wiring board has multiple insulators and conductors alternately laminated with the insulators. The multilayer wiring board includes multiple holes which are formed so as to penetrate from a surface of the multilayer wiring board in the thickness direction of the multilayer wiring board excluding at least one insulator from among the insulators. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013084729(A) |
申请公布日期 |
2013.05.09 |
| 申请号 |
JP20110223047 |
申请日期 |
2011.10.07 |
| 申请人 |
FUJITSU LTD |
发明人 |
KADOI KAZUHISA |
| 分类号 |
H05K1/02;H05K3/00;H05K3/46 |
主分类号 |
H05K1/02 |
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