发明名称 LIGHT-EMITTING DEVICE, LIGHT-EMITTING ELEMENT PACKAGE AND WIRING BOARD FOR MOUNTING LIGHT-EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To maintain an excellent heat dissipation property while employing a simple single-sided wiring board using an inexpensive circuit board. <P>SOLUTION: A light-emitting device includes: an electrically insulating board 10 having 80% or more of total reflectivity of at least a first principal plane 10a to light having a wavelength of 450 nm, and bendable with 50 mm or less of a curvature radius; a metal filling portion 30 composed of a metal material filled in a via hole 13 penetrating through the electrically insulating board 10; a copper wiring pattern 20p provided on the first principal plane 10a side of the electrically insulating board 10, and partially bent to a second principal plane 10b side of the electrically insulating board 10 together with the electrically insulating board 10; and a light-emitting element mounted on the metal filling portion 30 on the first principal plane 10a side, and wire-bonded to the copper wiring pattern 20p on the first principal plane 10a side. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013084803(A) 申请公布日期 2013.05.09
申请号 JP20110224089 申请日期 2011.10.11
申请人 HITACHI CABLE LTD 发明人 ISAKA FUMIYA;IMAI NOBORU;NAKADA KEITA
分类号 H01L33/64 主分类号 H01L33/64
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