DEFECT REVIEW DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a preferable method relating to wafer edge observation using an electron microscope for searching for a cause of the occurrence of foreign materials and the like, when having detected the foreign materials or defects in wafer inspection.

SOLUTION: A defect review device includes: a sample stage 24 for holding a semiconductor wafer; an electronic optical system for irradiating the semiconductor wafer with an electron beam; detectors 15 and 23 for detecting secondary electrons or reflection electrons obtained by the irradiation with the electron beam; detectors 34 and 35 for detecting an X ray emitted from the semiconductor wafer by the irradiation with the electron beam; a column 16 having a variable inclination angle. An imaging field of the column 16 is moved to a defect position of an edge of the semiconductor wafer by the sample stage 24 and the edge of the semiconductor wafer is irradiated with the electron beam in a state in which the column 16 is inclined.

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