| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a chip area of a semiconductor chip and time required for storing input to the semiconductor chip. <P>SOLUTION: A semiconductor wafer 1 of the present invention comprises: an anti-fuse circuit 12 including a plurality of anti-fuses 14 that are formed in a chip region 10, have insulator films and are turned into a conduction state by breakdown of the insulator films by applying voltage; a laser fuse circuit 22 including a plurality of laser fuses 24 that are formed on a dicing region 20 defining the chip region 10 corresponding to each of the plurality of anti-fuses 14, have wiring, and that are turned into a non-conduction state by disconnection of the wiring using laser irradiation; and a control circuit 13 for applying a voltage from a power supply to the insulator films included in the anti-fuses 14 corresponding to the laser fuses 24 turned into the non-conduction state in response to the input to the semiconductor chip, among the plurality of anti-fuses 14, thereby turning the anti-fuses 14 into the conduction state. <P>COPYRIGHT: (C)2013,JPO&INPIT |
