POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING RESIN PATTERN, CURED PRODUCT AND OPTICAL MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition capable of suppressing dissolution of an unexposed part during development.

SOLUTION: A positive photosensitive resin composition includes: an inorganic particle (component A); a dispersion agent having an acid group (component B); a solvent (component C); a polymer having a constitutional unit having a group detachable by acid and/or heat (a1) and the constitutional unit having a cross-linking group (a2) (component D); and a photoacid generating agent (component E). An acid value of the component D is 50 mgKOH/g.

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