METHOD OF FORMING BUMP FOR PACKAGE ON PACKAGE TYPE SUBSTRATE

摘要

PURPOSE: A method for forming a bump for a package on a package type substrate is provided to prevent faults in advance by performing a coining process on a solder bump. CONSTITUTION: A solder bump is formed on a chip mounting region(S1). A protection layer is formed on the chip mounting region(S3). The solder bump is buried in the protection layer. A package bump is formed in a region except the chip mounting region(S5). The protection layer is removed(S7). [Reference numerals] (AA) Start; (BB) End; (S1) Form a solder bump on a chip mounting region of a package substrate; (S3) Form a protection layer burying the solder bump; (S5) Form a package bump in a region except the chip mounting region; (S7) Remove the protection layer