| 摘要 |
PURPOSE: A semiconductor integrated circuit is provided to maximize a repair rate by maximally replacing a defective through silicon via using the minimum repair through silicon via. CONSTITUTION: A plurality of normal chip through vias(TSVn) vertically pass through a semiconductor chip. A plurality of repair chip through vias(RTSV) vertically pass through the semiconductor chip. A plurality of first regions(A1) and second regions(A2) are alternatively arranged in a transverse direction. A part of the normal chip through vias are vertically arranged in the first region with a preset interval. The repair chip through via and the normal chip through via are alternatively arranged in the second region in a vertical direction.
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