发明名称 CAMERA MODULE
摘要 PURPOSE: A camera module is provided to enable absorbing of loads which are repetitively applied to wire springs by including a shock-absorbing unit, thereby firmly fixing the camera module to a connection unit of PCBs(Printed Circuit Board). CONSTITUTION: A camera module comprises a first PCB(Printed Circuit Board)(10), a housing unit(20), a holder module(30), a second PCB(40), a third PCB(50), a plurality of wire springs(60), and a shock-absorbing unit(100). An image sensor is mounted on the first PCB. The housing unit is arranged in the upper part of the first PCB. The holder module is arranged by being separated from the inner bottom surface of the housing unit at a predetermined interval. A first coil is reeled in the outer periphery of the holder module, and the holder module includes at least one lens in the inside. The second PCB is joined to the bottom surface of the holder module. One end of the wire spring is connected to the second PCB, and the other end of the wire spring is connected to the third PCB. The shock-absorbing unit is formed in a connected portion of the wire springs and the third PCB to be integrated with the wire springs.
申请公布号 KR20130047344(A) 申请公布日期 2013.05.08
申请号 KR20110112306 申请日期 2011.10.31
申请人 LG INNOTEK CO., LTD. 发明人 JEONG, SEONG CHEOL;HA, TAE MIN
分类号 G03B3/02;G02B7/04;H04N5/232 主分类号 G03B3/02
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