METHOD OF ACCOMODATING ELECTRONIC COMPONENT IN CAVITY AND COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD MANUFACTURED THEREOF

摘要

PURPOSE: An electronic component accommodation method in a cavity and an ELECTRONIC COMPONENT EMBEDDED TYPE printed circuit board are provided to safely peel off an adhesion layer used in a process of fixing and accommodating an electronic component. CONSTITUTION: A cavity embeds an electronic component(170) in a hardened state insulation layer. An adhesion layer is formed on one surface of the insulation layer having the cavity formed. The electronic component accommodates the opposite side to the adhesion layer to expose a surface in which an IO terminal bump(171) is formed in the cavity. The electronic component accommodated in the cavity laminates a semi-hardened state first insulation layer(180) and a first copper thin film layer(190), and laminates by heating and pressurizing. The electronic component separates and removes the adhesion layer from a substrate and laminates a semi-hardened state second insulation layer(200) and a second copper thin film layer(210) and laminates by heating and pressurizing. Via holes(220,230) connect the first copper thin film layer or the second copper thin film layer of the outer surface of the substrate with the IO terminal bump of the electronic component.