METHOD AND APPARATUS FOR SEPARATING AND RECOVERING ELECTRIC/ELECTRONIC COMPONENTS AND METAL COMPOSITION OF PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method and a device for separating and collecting the components and metal substances of a printed circuit board are provided to collect all metal substances including low contents of rare metals from a printed circuit board by differently sorting electric and electronic devices and components, dust, and the components which are separated from the printed circuit board. CONSTITUTION: A method for separating and collecting the components and metal substances of a printed circuit board(PCB) includes: a step(S100) of polishing a soldering surface of a PCB using a polishing device; a step(S200) of collecting dust generated by polishing the soldering surface; a step(S300) of detaching and collecting electric and electronic devices and components attached to the surfaces of the components of the PCB; a step(S400) of separating the electric and electronic devices and components by part; and a step(S500) of respectively separating and collecting metal substances from the PCB from which the dust and the electric and electronic devices and components are detached. [Reference numerals] (AA) Start; (BB) End; (S100) Remove a metal plate and parts attached to a soldering surface of a printed circuit board; (S200) Polish the soldering surface of the printed circuit board; (S300) Collect and remove dust produced during polishing; (S400) Separate and collect electric and electronic parts attached to the printed circuit board; (S500) Separate metal substances and separate each part of electric and electronic components