METHODS OF FORMING BUMP STRUCTURES THAT INCLUDE A PROTECTION LAYER

摘要

PURPOSE: A method for forming bump structures including a protection layer is provided to improve the performance of a semiconductor device by preventing the oxidation of conductive pads by the protection layer. CONSTITUTION: A passivation layer is formed on a conductive pad(12) and an insulation material layer(10). The passivation layer is etched. A protection layer(202) is formed on the exposed part of the conductive pad and an opening part of the passivation layer. A thermosetting material layer(218A) is formed on the protection layer. The thermosetting material layer is etched. A conductive bump(24B) is formed on the conductive pad after the exposed part of the protection layer is removed.