发明名称 |
Package on Package Devices and Methods of Packaging Semiconductor Dies |
摘要 |
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a bump region and a tail region coupled to the bump region. The metal stud bumps are embedded in solder joints.
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申请公布号 |
US2013105979(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201213483734 |
申请日期 |
2012.05.30 |
申请人 |
YU CHEN-HUA;LEE CHIEN-HSUN;CHING CHEN YUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YU CHEN-HUA;LEE CHIEN-HSUN;CHING CHEN YUNG |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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