| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to form a pollution prevention layer in a semiconductor chip and to prevent copper as a bump material from diffusing into the semiconductor chip. CONSTITUTION: A semiconductor chip(10) has a front surface(1) and a rear surface(2) which faces the front surface. A penetration electrode(30) passes through the front surface and the rear surface of the semiconductor chip. The penetration electrode includes a barrier layer(32) which is formed in the sidewall of a via(H) and a seed layer(34) which is formed on the barrier layer. A pollution prevention layer(20) is formed near the rear surface. The pollution prevention layer prevents an external contamination from diffusing from the rear surface of the semiconductor chip into the semiconductor chip. |
